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Nexxim Simulator >
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Microstrip Elements >
Via Pad with Reference

Via Pad with Reference

Netlist Format

A via pad instance has the following netlist format:

Axxx n1 [n2 n3 n4 n5] [D=val] [DG=val] [W=val]
COMPONENT=viapad SUBSTRATE=substrate_name

n1 through n5 are the names of the nodes attached to the via pad. Any nodes not specified are modeled as open stubs. The entry COMPONENT=viapad identifies the element as a via pad.The entry SUBSTRATE=substrate_name identifies the microstrip substrate model name selected for the design (see Selecting a Microstrip Substrate). See the Microstrip (MS) Substrate for information on this substrate type.

**Via Through Hole with Reference Instance Parameters**
Parameter	Description	Unit	Default
D	Diameter of upper via hole	Meter	0.5e-3
DG	Diameter of lower via hole	Meter	D
W	Width and length of square pad	Meter	1e-3

Netlist Example

A23 Port1 Port2 Port3 Port4 net_49 D=0.0005 W=0.001
+ COMPONENT=viapad SUBSTRATE=FR4

where FR4, the selected layout technology or substrate type, has a definition such as:

.SUB FR4 MS( H=7.6200e-004 Er=4.4 TAND=0.02 TANM=0
+ MSat=0 MRem=0 HU=0.00508 MET1=1.72413793103448
+ T1=1.7145e-005 RGH=0mil)

Notes

1. [All substrates] The pad is connected through a via to a ground.

2. [All substrates] The pad is square.

3. [All substrates] Unconnected nodes are considered to be open.

4. [All substrates] Transitions to connected transmission lines are not included in this model.

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