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Nexxim Simulator >
Nexxim Component Models >
Microstrip Elements >
Microstrip Substrate Model

Microstrip Substrate Model

Defining a Microstrip Model

To add a microstrip substrate model to a new Nexxim design, select one of the MS substrate types from the Choose Layout Technology window that appears when you select Insert Nexxim Circuit Design from the Project pulldown in Designer. A substrate that is added from this window has a default substrate name and metallization parameters.

To add a new substrate to an existing design, expand the Project icon, then the Design icon. Right click on the Data icon, and select Add Substrate Definition. The Substrate Definition window appears. Add the substrate name and parameters as desired, then click OK. A substrate added in this manner requires you to specify the metallization parameters explicitly.

To edit the definition of a substrate, expand the Project icon, then the Design icon, then the Data icon. Click on the icon for the substrate you wish to edit. The Substrate Definition window appears. Add or modify the substrate parameters as desired, then click OK.

Microstrip Substrate Model Netlist Form

The Microstrip substrate model has the following netlist format:

.SUB substrate_name MS ([H=val] [ER=val] [HU=val] [TAND=val]

[MSAT=val] [MREM=val] [TANM=val]

[MET1=val] [T1=val] [MET2=val] [T2=val] [MET3=val] [T3=val]

[RGH=val])

The substrate_name is the name for the substrate type used in distributed elements that refer to this substrate definition. The entry MS is required to identify the Microstrip substrate type. The MS identifier must immediately follow the substrate_name.

Inside the parentheses, the labeled parameters may be entered in any order.

**Microstrip Substrate Parameters**
Parameter	Description	Unit	Default
ER	Dielectric constant of substrate, 1 £ ER £ 128	None	4.5
H	Substrate thickness, H > 0	Meter	1e-3
HU	Distance to top cover HU > 0 HU < 40´H enables covered microstrip modeling In several models, radiation effects are modeled when the cover height is not specified and may result in a slower simulation. HU > 40´H disables radiation modeling without introducing any undesirable effects.	Meter	0.0 (No cover)
MET1, MET2, MET3	Resistivity of metal layer 1, 2, and 3	mOhm-cm	0.0
MREM	4p ´ the remanent magnetization in gauss, MREM £ MSAT	None	0.0
MSAT	4p ´ the material saturation magnetization in gauss, MSAT ³ 0 The substrate is considered to be a dielectric substrate unless a non-zero positive MSAT is specified	None	0.0
RGH	RMS surface roughness	Meter	0.0
T1, T2, T3	Thickness of metal layer 1, 2, and 3	Meter	0.0
TAND	Dielectric loss tangent, [0,0.1]	None	0.0
TANM	Magnetic loss tangent, 0 £ TANM £ 0.1	None	0.0

Microstrip Substrate Model Netlist Example

.SUB FR4 MS( H=7.6200e-004 Er=4.4 TAND=0.02 TANM=0
+ MSat=0 MRem=0 HU=0.00508 MET1=1.72413793103448
+ T1=1.7145e-005 RGH=0mil)

Notes

1. Surface roughness in the substrate definition is not supported in some MCPL implementations.

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