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Nexxim Simulator >
Nexxim Component Models >
Microstrip Elements >
Via Through Hole

Via Through Hole

Netlist Format

A via hole instance has the following netlist format:

Axxx n1 [D=val] [DG=val]
COMPONENT=viahole SUBSTRATE=substrate_name

n1 is the name of the node attached to the via through hole. The other node is ground, and is not specified in the syntax. The entry COMPONENT=viahole identifies the element as a via through hole. The entry SUBSTRATE=substrate_name identifies the microstrip substrate model name selected for the design (see Selecting a Microstrip Substrate). See the Microstrip (MS) Substrate for information on this substrate type.

**Via Through Hole Instance Parameters**
Parameter	Description	Unit	Default
D	Diameter of upper via hole	Meter	1e-3
DG	Diameter of lower via hole	Meter	D

Netlist Example

A19 Port1 D=0.001 COMPONENT=viahole SUBSTRATE=FR4

where FR4, the selected layout technology or substrate type, has a definition such as:

.SUB FR4 MS( H=7.6200e-004 Er=4.4 TAND=0.02 TANM=0
+ MSat=0 MRem=0 HU=0.00508 MET1=1.72413793103448
+ T1=1.7145e-005 RGH=0mil)

Notes

1. [All substrates] If metallization is not specified in the referenced substrate definition, the via element behaves as an inductance only.

2. [Microstrip] To get accurate results, set H << l, where:
l is the wavelength, H is the substrate height defined in the referenced substrate type.

3. [Microstrip] Radiation loss is included if the cover height is not defined in the substrate definition.

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