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Ansoft Designer / Ansys Designer 在线帮助文档：

Nexxim Simulator >
Nexxim Component Models >
Microstrip Elements >
   Bond Pad       

Bond Pad

 

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Netlist Format

A bond pad instance has the following netlist format:

Axxx n1 [X=val] [Y=val] D=val
COMPONENT=msbondpad SUBSTRATE=substrate_name

n1 is the name of the node attached to the pad. The entry COMPONENT=msbondpad identifies the element as a bond pad. The entry SUBSTRATE=substrate_name identifies the microstrip substrate model name selected for the design (see Selecting a Microstrip Substrate). See the Microstrip (MS) Substrate for information on this substrate type.

 


Bond Pad Instance Parameters

Parameter

Description

Unit

Default

X

Length of the bonding pad

Meter

2.0e-3

Y

Width of the bonding pad

Meter

1.0e-3

Netlist Example

Apad1 Port1 X=1e-3 Y=2e-3 COMPONENT=msbondpad SUBSTRATE=FR4

where FR4, the selected layout technology or substrate type, has a definition such as:

.SUB FR4 MS( H=7.6200e-004 Er=4.4 TAND=0.02 TANM=0
+ MSat=0 MRem=0 HU=0.00508 MET1=1.72413793103448
+ T1=1.7145e-005 RGH=0mil)

Notes

1. [Microstrip] The model includes dispersion effects.

 



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