国立台湾大学IEEE distinguished Lectuer王暉教授学术报告通知
12-12
Title:
Current Status and Future Trends for Si and Compound MMICs
in Millimeter-wave Regime and Related Issues for System on Chip (SOC)
and/or System in Package (SIP) Applications
题目:
毫米波时代硅/化合物MMIC的现状和趋势 及 SoC/SiP应用的相关话题
时间:9月8日 星期二 上午10点-
地点:东主楼10区309
Lectuer: Dr. Huei Wang
Professor, Dept. of Electrical Engineering and Graduate Institute of Communication Engineering
National Taiwan University
报告人: 王暉博士(国立台湾大学教授,IEEE distinguish Lecture 2007-2009)
Abstract:
The anticipated presentation will cover the current status and future trends of millimeter-wave MMICs, including those using III-V compound (GaAs, InP, GaN, etc.) and Si-based (CMOS, SiGe HBT and BiCMOS) MMIC technologies. Millimeter-wave MMICs used to be applied to military and astronomy systems for long time and started to be utilized for civil applications in the decade, such as communications and automotive radars. The evolution of IC technologies has enabled the performance of Si-based MMICs over 100 GHz, even in standard bulk CMOS processes. This is believed to have a major impact in the future development of millimeter-wave systems. Since low-cost mass-production potential pushes forward the technology, a very high integration of circuit functions on a chip, such as RF, base-band circuitry, automatic-control for a steady operation, and maybe even the antenna, etc. should be included, and thus the system on chip (SOC) issues should be addressed, especially in MMW regime. Moreover, millimeter-wave packaging cost always dominated in the module development. In order to simplify the assembly and reduced cost, the concept of system in package (SIP) has been proposed. This presentation will also survey the current technologies for SOC and SIP and discuss related issues and challenges.
Biography of the lectuer:
Huei Wang (S’83-M’87-SM’95-F’06) was born in Tainan, Taiwan, on March 9, 1958. He received the B. S. degree in electrical engineering from National Taiwan University, Taipei, Taiwan, in 1980, and the M. S. and Ph. D. degrees in electrical engineering from Michigan State University, East Lansing, Michigan in 1984 and 1987, respectively.
During his graduate study, he was engaged in the research on theoretical and numerical analysis of electromagnetic radiation and scattering problems. He was also involved in the development of microwave remote detecting/sensing systems. Dr. Wang joined Electronic Systems and Technology Division of TRW Inc. since 1987. He has been an MTS and Staff Engineer responsible for MMIC modeling of CAD tools, MMIC testing evaluation and design and became the Senior Section Manager of MMW Sensor Product Section in RF Product Center. He visited the Institute of Electronics, National Chiao-Tung University, Hsin-Chu, Taiwan, in 1993 to teach MMIC related topics and returned to TRW in 1994. He joined the faculty of the Department of Electrical Engineering of National Taiwan University, Taipei, Taiwan, Republic of China, as a Professor in February 1998. He has been served as the Director of Graduate Institute of Communication Engineering of National Taiwan University from Aug. 2006 to July 2009.
Dr. Wang is a member of the honor society Phi Kappa Phi and Tau Beta Pi. He received the Distinguished Research Award of National Science Council, Taiwan, at 2003. He was the Richard M. Hong Endowed Chair Professor of National Taiwan University in 2005-2007. He was elected as an IEEE Fellow in 2006, and has been appointed as an IEEE Distinguished Microwave Lecturer for the term of 2007-2009. Dr. Wang received the Academic Achievement Award from Ministry of Education, Taiwan, in 2007, and the Distinguished Research Award from Pan Wen-Yuan’s Foundation in 2008.
王暉教授的研究領域主要著重於高頻積體電路。所研究電路的頻譜由射頻(Radio Frequency, RF)及微波,以至於毫米波頻段。研究的項目包括電路設計,元件模型及量測。電路設計之內容涵蓋電路架構之研究,電路的分析、模擬及設計;而元件模型則包括固態元件的模型分析及被動元件的分析與設計。為了電路及元件模型的驗證,高頻量測亦為研究的重點。上述之射頻微波及毫米波積體電路的應用則包含無線通訊,衛星及雷達的收發系統,及天文觀測等。
主页:http://www.ee.ntu.edu.tw/profile?id=43
publication list:http://www.ee.ntu.edu.tw/publist?id=43
Current Status and Future Trends for Si and Compound MMICs
in Millimeter-wave Regime and Related Issues for System on Chip (SOC)
and/or System in Package (SIP) Applications
题目:
毫米波时代硅/化合物MMIC的现状和趋势 及 SoC/SiP应用的相关话题
时间:9月8日 星期二 上午10点-
地点:东主楼10区309
Lectuer: Dr. Huei Wang
Professor, Dept. of Electrical Engineering and Graduate Institute of Communication Engineering
National Taiwan University
报告人: 王暉博士(国立台湾大学教授,IEEE distinguish Lecture 2007-2009)
Abstract:
The anticipated presentation will cover the current status and future trends of millimeter-wave MMICs, including those using III-V compound (GaAs, InP, GaN, etc.) and Si-based (CMOS, SiGe HBT and BiCMOS) MMIC technologies. Millimeter-wave MMICs used to be applied to military and astronomy systems for long time and started to be utilized for civil applications in the decade, such as communications and automotive radars. The evolution of IC technologies has enabled the performance of Si-based MMICs over 100 GHz, even in standard bulk CMOS processes. This is believed to have a major impact in the future development of millimeter-wave systems. Since low-cost mass-production potential pushes forward the technology, a very high integration of circuit functions on a chip, such as RF, base-band circuitry, automatic-control for a steady operation, and maybe even the antenna, etc. should be included, and thus the system on chip (SOC) issues should be addressed, especially in MMW regime. Moreover, millimeter-wave packaging cost always dominated in the module development. In order to simplify the assembly and reduced cost, the concept of system in package (SIP) has been proposed. This presentation will also survey the current technologies for SOC and SIP and discuss related issues and challenges.
Biography of the lectuer:
Huei Wang (S’83-M’87-SM’95-F’06) was born in Tainan, Taiwan, on March 9, 1958. He received the B. S. degree in electrical engineering from National Taiwan University, Taipei, Taiwan, in 1980, and the M. S. and Ph. D. degrees in electrical engineering from Michigan State University, East Lansing, Michigan in 1984 and 1987, respectively.
During his graduate study, he was engaged in the research on theoretical and numerical analysis of electromagnetic radiation and scattering problems. He was also involved in the development of microwave remote detecting/sensing systems. Dr. Wang joined Electronic Systems and Technology Division of TRW Inc. since 1987. He has been an MTS and Staff Engineer responsible for MMIC modeling of CAD tools, MMIC testing evaluation and design and became the Senior Section Manager of MMW Sensor Product Section in RF Product Center. He visited the Institute of Electronics, National Chiao-Tung University, Hsin-Chu, Taiwan, in 1993 to teach MMIC related topics and returned to TRW in 1994. He joined the faculty of the Department of Electrical Engineering of National Taiwan University, Taipei, Taiwan, Republic of China, as a Professor in February 1998. He has been served as the Director of Graduate Institute of Communication Engineering of National Taiwan University from Aug. 2006 to July 2009.
Dr. Wang is a member of the honor society Phi Kappa Phi and Tau Beta Pi. He received the Distinguished Research Award of National Science Council, Taiwan, at 2003. He was the Richard M. Hong Endowed Chair Professor of National Taiwan University in 2005-2007. He was elected as an IEEE Fellow in 2006, and has been appointed as an IEEE Distinguished Microwave Lecturer for the term of 2007-2009. Dr. Wang received the Academic Achievement Award from Ministry of Education, Taiwan, in 2007, and the Distinguished Research Award from Pan Wen-Yuan’s Foundation in 2008.
王暉教授的研究領域主要著重於高頻積體電路。所研究電路的頻譜由射頻(Radio Frequency, RF)及微波,以至於毫米波頻段。研究的項目包括電路設計,元件模型及量測。電路設計之內容涵蓋電路架構之研究,電路的分析、模擬及設計;而元件模型則包括固態元件的模型分析及被動元件的分析與設計。為了電路及元件模型的驗證,高頻量測亦為研究的重點。上述之射頻微波及毫米波積體電路的應用則包含無線通訊,衛星及雷達的收發系統,及天文觀測等。
主页:http://www.ee.ntu.edu.tw/profile?id=43
publication list:http://www.ee.ntu.edu.tw/publist?id=43
海报~~~ 欢迎校内外 对 MMIC SIP SoC感兴趣的同学们踊跃参加哦~~
原来是线路的兄弟,我们也去捧场啊。呵呵。
去年来过我们那里,用英语讲的,不是太懂,而且讲的不是很详细,但是看结果和论文,觉得做的不错,台湾的RFIC做的挺好的
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