同轴线馈电 objects "substrate" and "feed" intersect

微带贴片天线的设计时，介质基板分有三层，上下两层用罗杰斯的板子中间用空气层，采用的是同轴线馈电方式，同轴内芯用pec导体材料，同轴圆柱体穿过三层介质基板，仿真时提示出错
objects "substrate11" and "feed" intersect
objects "substrate2" and "feed" intersect
objects "substrate12" and "feed" intersect
substrate11 substrate12 是上下两层罗杰斯的板子 substrate2是空气层  feed为同轴馈线
  请问是为什么

介质层没有减去feed