请教各位——用那个软件设计封装？

呵呵，我也想问这个问题。自己觉得是不是应该在HFSS中仿真一下封装引脚的性能。
我在ansoft网站上看到 SIwave的软件，有点类似这个。
Signal- and Power-Integrity Analysis for High-Performance PCBs and IC Packages
SIwave?analyzes complex printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. The tool allows engineers to extract frequency-dependent circuit models of power distribution and signal nets directly from device layout (physical CAD) databases. Such circuit models aid in the identification of signal integrity and power-distribution network problems and are critical to designers seeking first-pass system success. An integrated DC IR drop computation module allows engineers to perform pre/post layout IR-drop verification to ensure that power distribution networks have the proper bump, ball, and pin sizes, as well as proper copper weighting. SIwave also helps mitigate electromigration concerns by flagging regions of high current density.

CST2009的套装可以很方便的仿真封装，包含集成芯片在内的系统仿真，太强大了

cst我不太会用，一直用的都是ansoft公司的，感觉还是蛮顺手的！

越来越强大了，cst，已经很久没碰过这个软件了

也是听说来的，呵呵。

没做过这个东西哦
帮顶一下
希望高手能够解答

CST是德国公司推出的高频三维电磁场仿真软件！

CST是德国公司推出的高频三维电磁场仿真软件！